Our Partners
The Center for Heterogeneous Integration Research in Packaging was created by the Semiconductor Research Corp. in 2019 at Â鶹Éç and Purdue University. The center’s founding members are ARM, IBM, Intel, NXP Semiconductors, Texas Instruments and Samsung. CHIRP is part of S3IP, Â鶹Éç’s New York State Center of Excellence, with offices at the campus’ Innovative Technologies Complex.
